SK Hynix proposes financing Toshiba chip deal via convertible bonds: sources

SEOUL/TOKYO (Reuters) - SK Hynix Inc has proposed that its financing for a Japan government-led group bidding for Toshiba Corp's chip unit be done through convertible bonds, two sources familiar with the matter said, potentially allowing it to have an equity interest in the world's No. 2 NAND chip maker.

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