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Thursday, December 17, 2015

Hon Hai plans $1.5 billion HK IPO for Foxconn Interconnect Technology unit: IFR

HONG KONG (Reuters) - Taiwan's Hon Hai Precision Industry Co plans to spin off its Foxconn Interconnect Technology unit in a Hong Kong initial public offering worth at least $1.5 billion, IFR reported on Thursday, citing people close to the deal.


from Reuters: Technology News http://ift.tt/1IWaNVE

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