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Wednesday, July 26, 2017

LeEco's Coolpad says lawsuit filed against unit over loan due next month

HONG KONG (Reuters) - Chinese smartphone maker Coolpad Group, part of the cash-strapped LeEco technology conglomerate, said on Thursday a bank has sued a subsidiary, demanding early repayment of an 80 million yuan ($11.9 million) loan due Aug. 15.


from Reuters: Technology News http://ift.tt/2u0Ptrj

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